掩模版加工
掩模版加工能力介绍：
制版工艺：激光直写/电子束光刻
铬板材料：
材料：石英玻璃/苏打玻璃
常规尺寸：3006,4009,5009,6012,6025,7012,9012,12"x12",14“x14"
厚度：1.5+0.2mm,2.3+0.2mm,3.0+0.2mm,4.8±0.2mm,6.35±0.2mm
铬膜类型：低反射率铬膜
光学密度Optical Density(λ=450nm)：Between Plates3.0 + 0.3 In Plate ± 0.3
反射率 Reflectivity(入=436nm)：Between Plates10 ± 5% In Plate ± 2%
铬板精度：
Item/Class | A | B | C | D | E | F | G | H/I |
Min.Line/Space Width on Wafer | ＞1.0um | 1.0um | 0.8um | 0.5um | 0.35um | 0.2um | 0.18um | 0.15/0.13um |
CD Control | ±0.3um | ±0.25um | ±0.2um | ±0.15um | ±0.1um | ±0.07um | ±0.05um | ±0.025um |
CD Uniformity | 0.4um | 0.3um | 0.25um | 0.2um | 0.12um | 0.1um | 0.07um | 0.03um |
Registration Accuracy | ±0.3um | ±0.25um | ±0.2um | ±0.15um | ±0.12um | ±0.1um | ±0.07um | ±0.035um |
Overlay Accuracy | ±0.3um | ±0.25um | ±0.2um | ±0.15um | ±0.1um | ±0.08um | ±0.06um | ±0.035um |
Defect Size | ＜1.5um | ＜1.0um | ＜1.0um | ＜0.8um | ＜0.75um | ＜0.5um | ＜0.35um | ＜0.3um |
