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Total Thickness Variation：

总厚度变化：

The difference between the highest and the lowest elevation of the top surface of a clamped wafer.

夹持晶圆顶面的最高和最低高度之间的差异。

The back surface referenced.

参考背面。

otal Indicated Reading：总指示读数：

The difference between the highest point above and the lowest point below the front surface referenced focal plane of a clamped wafer.

夹持晶圆的前表面参考焦平面上方的最高点和下方的最低点之间的差值。

3 points on the front surface generally used.

一般采用正面3点。

Local Thickness Variation:

局部厚度变化：

The difference between the highest point and the lowest point within a site of the top surface of a clamped wafer.

夹持晶圆顶面某个位置内的最高点和最低点之间的差值。

The back surface referenced.

参考背面。

Percent LTV：生命周期价值百分比：

Percentage of sites on a wafer within the specified LTV value.

晶圆上指定 LTV 值内的位点百分比。

Wrap

The difference between the highest point above and the lowest point below the front surface referenced focal plane of an

前表面参考焦平面上方的最高点和下方的最低点之间的差值

unclamped wafer.未夹紧的晶圆。

A least square fit on the front surface generally used.

通常使用前表面的最小二乘法拟合。